Toshiba 常用eMMC 列表
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关键字： Toshiba 常用eMMC 列表
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Toshiba 常用eMMC 列表
Toshiba 常用eMMC 容量包括4GB 8GB 16GB 32GB 64GB 128GB,适用于消费等级和宽温度等级等各种噢用途。其型号列表如下：
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容量 |
器件型号 |
e-MMC |
最大数据速率 |
电源电压 |
工作 |
封装 |
|
版本 |
（MB／s） |
Vcc（V） |
VccQ（V） |
温度（°C） |
尺寸（mm） |
代码 |
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4 Gbytes |
THGBMNG5D1LBAIT |
5 |
400 |
2.7 to 3.6 |
1.70 to 1.95, |
-25 to 85 |
11×10×0.8 |
P-WFBGA153-1110-0.50 |
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2.7 to 3.6 |
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THGBMNG5D1LBAIL |
5 |
400 |
2.7 to 3.6 |
1.70 to 1.95, 2.7 to 3.6 |
-25 to 85 |
11.5×13×0.8 |
P-WFBGA153-1113-0.50 |
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8 Gbytes |
THGBMHG6C1LBAIL |
5.1 |
400 |
2.7 to 3.6 |
1.70 to 1.95, 2.7 to 3.6 |
-25 to 85 |
11.5×13×0.8 |
P-WFBGA153-1113-0.50 |
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THGBMHG6C1LBAU6 |
5.1 |
400 |
2.7 to 3.6 |
1.70 to 1.95, 2.7 to 3.6 |
-40 to 105 (1) |
11.5×13×0.8 |
P-WFBGA153-1113-0.50 |
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16 Gbytes |
THGBMHG7C1LBAIL |
5.1 |
400 |
2.7 to 3.6 |
1.70 to 1.95, 2.7 to 3.6 |
-25 to 85 |
11.5×13×0.8 |
P-WFBGA153-1113-0.50 |
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THGBMHG7C2LBAU7 |
5.1 |
400 |
2.7 to 3.6 |
1.70 to 1.95, 2.7 to 3.6 |
-40 to 105 (1) |
11.5×13×1.0 |
P-VFBGA153-1113-0.50 |
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32 Gbytes |
THGBMHG8C2LBAIL |
5.1 |
400 |
2.7 to 3.6 |
1.70 to 1.95, 2.7 to 3.6 |
-25 to 85 |
11.5×13×0.8 |
P-WFBGA153-1113-0.50 |
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THGBMHG8C4LBAU7 |
5.1 |
400 |
2.7 to 3.6 |
1.70 to 1.95, 2.7 to 3.6 |
-40 to 105 (1) |
11.5×13×1.0 |
P-VFBGA153-1113-0.50 |
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64 Gbytes |
THGBMHG9C4LBAIR |
5.1 |
400 |
2.7 to 3.6 |
1.70 to 1.95, 2.7 to 3.6 |
-25 to 85 |
11.5×13×1.0 |
P-VFBGA153-1113-0.50 |
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THGBMHG9C8LBAU8 |
5.1 |
400 |
2.7 to 3.6 |
1.70 to 1.95, 2.7 to 3.6 |
-40 to 105 (1) |
11.5×13×1.2 |
P-TFBGA153-1113-0.50 |
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128 Gbytes |
THGBMHT0C8LBAIG |
5.1 |
400 |
2.7 to 3.6 |
1.70 to 1.95, 2.7 to 3.6 |
-25 to 85 |
11.5×13×1.2 |
P-TFBGA153-1113-0.50 |
Toshiba 常用eMMC 列表 2019-06更新
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Item Name |
Technology |
JEDEC Standard |
Temperature |
Package |
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THGBMDG5D1LBAIT |
15nm |
JEDEC 5.0 |
- 25°C to 85°C |
153FBGA 11x10 |
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THGBMDG5D1LBAIL |
15nm |
JEDEC 5.0 |
- 25°C to 85°C |
153FBGA 11.5x13 |
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THGBMHG6C1LBAIL |
15nm |
JEDEC 5.1 |
- 25°C to 85°C |
153FBGA 11.5x13 |
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THGBMHG6C1LBAWL |
15nm |
JEDEC 5.1 |
- 40°C to 105 °C |
153FBGA 11.5x13 |
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THGBMHG7C1LBAIL |
15nm |
JEDEC 5.1 |
- 25°C to 85°C |
153FBGA 11.5x13 |
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THGBMHG7C2LBAWR |
15nm |
JEDEC 5.1 |
- 40°C to 105 °C |
153FBGA 11.5x13 |
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THGBMHG7C2LBAW7 |
15nm |
JEDEC 5.1 |
- 40°C to 105 °C |
153FBGA 11.5x13 |
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THGBMHG8C2LBAIL |
15nm |
JEDEC 5.1 |
- 25°C to 85°C |
153FBGA 11.5x13 |
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THGBMHG8C4LBAU7 |
15nm |
JEDEC 5.1 |
- 40°C to 105 °C |
153FBGA 11.5x13 |
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THGBMHG9C4LBAIR |
15nm |
JEDEC 5.1 |
- 25°C to 85°C |
153FBGA 11.5x13 |
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THGBMHG9C8LBAU8 |
15nm |
JEDEC 5.1 |
- 40°C to 105 °C |
153FBGA 11.5x13 |
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THGBMGG9U4LBAIR |
15nm TLC |
JEDEC 5.1 |
- 25°C to 85°C |
153FBGA 11.5x13 |
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THGBMHT0C8LBAIG |
15nm |
JEDEC 5.1 |
- 25°C to 85°C |
153FBGA 11.5x13 |
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THGBMGT0U8LBAIG |
15nm TLC |
JEDEC 5.1 |
- 25°C to 85°C |
153FBGA 11.5x13 |
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