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                            | Toshiba 常用eMMC 列表
                                
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                        | 关键字: Toshiba 常用eMMC 列表 |  
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	Toshiba 常用eMMC 列表 
	  
	Toshiba 常用eMMC 容量包括4GB 8GB 16GB 32GB 64GB 128GB,适用于消费等级和宽温度等级等各种噢用途。其型号列表如下: 
	  
	
		
		
		
		
	
	
		
			| 容量 | 器件型号 | e-MMC | 最大数据速率 | 电源电压 | 工作 | 封装 |  
			| 版本 | (MB/s) | Vcc(V) | VccQ(V) | 温度(°C) | 尺寸(mm) | 代码 |  
			| 4 Gbytes | THGBMNG5D1LBAIT | 5 | 400 | 2.7 to 3.6 | 1.70 to 1.95, | -25 to 85 | 11×10×0.8 | P-WFBGA153-1110-0.50 |  
			| 2.7 to 3.6 |  
			| THGBMNG5D1LBAIL | 5 | 400 | 2.7 to 3.6 | 1.70 to 1.95, 2.7 to 3.6 | -25 to 85 | 11.5×13×0.8 | P-WFBGA153-1113-0.50 |  
			| 8 Gbytes | THGBMHG6C1LBAIL | 5.1 | 400 | 2.7 to 3.6 | 1.70 to 1.95, 2.7 to 3.6 | -25 to 85 | 11.5×13×0.8 | P-WFBGA153-1113-0.50 |  
			| THGBMHG6C1LBAU6 | 5.1 | 400 | 2.7 to 3.6 | 1.70 to 1.95, 2.7 to 3.6 | -40 to 105 (1) | 11.5×13×0.8 | P-WFBGA153-1113-0.50 |  
			| 16 Gbytes | THGBMHG7C1LBAIL | 5.1 | 400 | 2.7 to 3.6 | 1.70 to 1.95, 2.7 to 3.6 | -25 to 85 | 11.5×13×0.8 | P-WFBGA153-1113-0.50 |  
			| THGBMHG7C2LBAU7 | 5.1 | 400 | 2.7 to 3.6 | 1.70 to 1.95, 2.7 to 3.6 | -40 to 105 (1) | 11.5×13×1.0 | P-VFBGA153-1113-0.50 |  
			| 32 Gbytes | THGBMHG8C2LBAIL | 5.1 | 400 | 2.7 to 3.6 | 1.70 to 1.95, 2.7 to 3.6 | -25 to 85 | 11.5×13×0.8 | P-WFBGA153-1113-0.50 |  
			| THGBMHG8C4LBAU7 | 5.1 | 400 | 2.7 to 3.6 | 1.70 to 1.95, 2.7 to 3.6 | -40 to 105 (1) | 11.5×13×1.0 | P-VFBGA153-1113-0.50 |  
			| 64 Gbytes | THGBMHG9C4LBAIR | 5.1 | 400 | 2.7 to 3.6 | 1.70 to 1.95, 2.7 to 3.6 | -25 to 85 | 11.5×13×1.0 | P-VFBGA153-1113-0.50 |  
			| THGBMHG9C8LBAU8 | 5.1 | 400 | 2.7 to 3.6 | 1.70 to 1.95, 2.7 to 3.6 | -40 to 105 (1) | 11.5×13×1.2 | P-TFBGA153-1113-0.50 |  
			| 128 Gbytes | THGBMHT0C8LBAIG | 5.1 | 400 | 2.7 to 3.6 | 1.70 to 1.95, 2.7 to 3.6 | -25 to 85 | 11.5×13×1.2 | P-TFBGA153-1113-0.50 |  
	Toshiba 常用eMMC 列表 2019-06更新 
	  
	
		
		
		
		
		
		
	
	
		
			| Item Name | Technology | JEDEC Standard | Temperature | Package |  |  
			| THGBMDG5D1LBAIT | 15nm | JEDEC  5.0 | - 25°C to 85°C | 153FBGA  11x10 |  |  
			| THGBMDG5D1LBAIL | 15nm | JEDEC  5.0 | - 25°C to 85°C | 153FBGA 11.5x13 |  |  
			| THGBMHG6C1LBAIL | 15nm | JEDEC 5.1 | - 25°C to 85°C | 153FBGA 11.5x13 |  |  
			| THGBMHG6C1LBAWL | 15nm | JEDEC  5.1 | - 40°C to 105 °C | 153FBGA 11.5x13 |  |  
			| THGBMHG7C1LBAIL | 15nm | JEDEC 5.1 | - 25°C to 85°C | 153FBGA 11.5x13 |  |  
			| THGBMHG7C2LBAWR | 15nm | JEDEC  5.1 | - 40°C to 105 °C | 153FBGA 11.5x13 |  |  
			| THGBMHG7C2LBAW7 | 15nm | JEDEC  5.1 | - 40°C to 105 °C | 153FBGA 11.5x13 |  |  
			| THGBMHG8C2LBAIL | 15nm | JEDEC 5.1 | - 25°C to 85°C | 153FBGA 11.5x13 |  |  
			| THGBMHG8C4LBAU7 | 15nm | JEDEC  5.1 | - 40°C to 105 °C | 153FBGA 11.5x13 |  |  
			| THGBMHG9C4LBAIR | 15nm | JEDEC 5.1 | - 25°C to 85°C | 153FBGA 11.5x13 |  |  
			| THGBMHG9C8LBAU8 | 15nm | JEDEC  5.1 | - 40°C to 105 °C | 153FBGA 11.5x13 |  |  
			| THGBMGG9U4LBAIR | 15nm TLC | JEDEC 5.1 | - 25°C to 85°C | 153FBGA 11.5x13 |  |  
			| THGBMHT0C8LBAIG | 15nm | JEDEC 5.1 | - 25°C to 85°C | 153FBGA 11.5x13 |  |  
			| THGBMGT0U8LBAIG | 15nm TLC | JEDEC 5.1 | - 25°C to 85°C | 153FBGA 11.5x13 |  |  
	  
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