Samsung UFS 芯片常用型号
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关键字： Universal Flash Storage SamSung
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Samsung UFS 芯片常用型号
SAMSUNG UFS 芯片型号列表（持续更新）
UFS2.0芯片
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Partnumber |
Density |
Package Size |
Temperature(℃) |
Version |
MLC |
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KLUBG4G1CE-B0B1 |
32GB |
11.5x13x1.0 |
-25°C ~ 85°C |
2.0 |
G3 1Lane |
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KLUCG4J1BB-B0B1 |
64GB |
11.5x13x1.0 |
-25°C ~ 85°C |
2.0 |
G2 2Lane |
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KLUCG4J1CB-B0B1 |
64GB |
11.5x13x1.0 |
-25°C ~ 85°C |
2.0 |
G3 1Lane |
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KLUDG8J1BB-B0B1 |
128GB |
11.5x13x1.2 |
-25°C ~ 85°C |
2.0 |
G2 2Lane |
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KLUDG8J1CB-B0B1 |
128GB |
11.5x13x1.2 |
-25°C ~ 85°C |
2.0 |
G3 1Lane |
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KLUEG8U1EM-B0B1 |
256GB |
11.5x13x1.2 |
-25℃ ~ 85℃ |
2.0 |
G3 2Lane |
UFS2.1芯片列表：
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Part Number |
Version |
Density |
Voltage |
Interface |
Package Size |
Temp. |
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KLUEG8U1EM-B0C1 |
UFS 2.1 |
256GB |
1.8 / 3.3 V |
G3 2Lane |
11.5 x 13 x 1.0 mm |
-25 ~ 85 °C |
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KLUCG4J1ED-B0C1 |
UFS 2.1 |
64GB |
1.8 / 3.3 V |
G3 2Lane |
11.5 x 13 x 1.0 mm |
-25 ~ 85 °C |
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KLUEGAJ1ZD-B0CP |
UFS 2.1 |
256GB |
1.8 / 3.3 V |
G3 2Lane |
11.5 x 13 x 1.65 mm |
-40 ~ 105 °C |
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KLUEGAJ1ZD-B0CQ |
UFS 2.1 |
256GB |
1.8 / 3.3 V |
G3 2Lane |
11.5 x 13 x 1.65 mm |
-40 ~ 105 °C |
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KLUCG4J1ZD-B0CP |
UFS 2.1 |
64GB |
1.8 / 3.3 V |
G3 2Lane |
11.5 x 13 x 1.2 mm |
-40 ~ 105 °C |
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KLUEG8U1EA-B0C1 |
UFS 2.1 |
256GB |
1.8 / 3.3 V |
G3 2Lane |
11.5 x 13 x 1.0 mm |
-25 ~ 85 °C |
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KLUCG4J1ZD-B0CQ |
UFS 2.1 |
64GB |
1.8 / 3.3 V |
G3 2Lane |
11.5 x 13 x 1.2 mm |
-40 ~ 105 °C |
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KLUDG8J1ZD-B0CP |
UFS 2.1 |
128GB |
1.8 / 3.3 V |
G3 2Lane |
11.5 x 13 x 1.2 mm |
-40 ~ 105 °C |
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KLUDG4U1EA-B0C1 |
UFS 2.1 |
128GB |
1.8 / 3.3 V |
G3 2Lane |
11.5 x 13 x 1.0 mm |
-25 ~ 85 °C |
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KLUDG8V1EE-B0C1 |
UFS 2.1 |
128GB |
1.8 / 3.3 V |
G3 2Lane |
11.5 x 13 x 1.0 mm |
-25 ~ 85 °C |
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KLUDG8J1ZD-B0CQ |
UFS 2.1 |
128GB |
1.8 / 3.3 V |
G3 2Lane |
11.5 x 13 x 1.2 mm |
-40 ~ 105 °C |
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