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Micron Serial NAND


关键字: Serial NAND

  

 “Embedded applications” has become an umbrella term for some of the most compelling devices available, including intelligent or interactive toys, books, and games; Web-enabled printers and computer peripherals; and backward-compatible WiMAX boxes. In the past, these embedded designs relied only on serial peripheral interface (SPI) NOR Flash for code shadowing, data storage, or storing BIOS and firmware. But as embedded applications continue to evolve and require more density, Serial NAND devices, with the lowest cost-per-megabit of any serial flash solution, offer the right option for them.

With four times or more the density of SPI NOR, Serial NAND is a great alternative to NOR for many embedded designs. And since Serial NAND has the lowest cost-per-megabit of any serial Flash solution, it’s also a great way to lower your BOM cost.

 

Part Density Status Width Voltage Package Pin Count Bits/Cell Op Temp
MT29F1G01AAADDH4 1Gb  Production  x1  3.3V  VFBGA  63-ball  SLC  0C to +70C 
MT29F1G01AAADDH4-IT 1Gb  Production  x1  3.3V  VFBGA  63-ball  SLC  -40C to +85C 
MT29F1G01ZACM58A3WC1 1Gb  End of Life  x1  3.3V  Wafer  n/a  SLC  0C to +70C 
MT29F2G01AAAEDH4 2Gb  Production  x1  3.3V  VFBGA  63-ball  SLC  0C to +70C 
MT29F2G01AAAEDH4-IT 2Gb  Production  x1  3.3V  VFBGA  63-ball  SLC  -40C to +85C 
MT29F2G01AAAEDHC 2Gb  End of Life  x1  3.3V  VFBGA  63-ball  SLC  0C to +70C 
MT29F2G01AAAEDHC-IT 2Gb  End of Life  x1  3.3V  VFBGA  63-ball  SLC  -40C to +85C 
MT29F4G01AAADDHC 4Gb  Production  x1  3.3V  VFBGA  63-ball  SLC  0C to +70C 
MT29F4G01AAADDHC-IT 4Gb  Production  x1  3.3V  VFBGA  63-ball  SLC  -40C to +85C 






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